Research Article
Elektronik Devrelerdeki Silindirik Soğutuculardan Kaynaklanan Elektromanyetik Girişimlerin 0-10 GHz Bandında Araştırılması
Abstract
Genellikle soğutucular, PCB/ICs ve elektronik
cihazların sıcaklığını belirli bir aralıkta tutmak için yaygın olarak
kullanılırlar. Soğutuculardan, hem termal olarak maksimum soğutma hem de
çevresindeki komponentlere minimum elektromanyetik girişim (EMI) sağlaması
beklenir. Özellikle yüksek frekanslarda çalışan cihazlarda, soğutucuların
elektriksel boyutları çalışma frekansının dalga boyuyla karşılaştırılabilir ise
bu yapılar anten gibi davranır. Bu çalışmada, elektronik devrelerde kullanılan
silindirik yapıdaki soğutucuların EMI davranışları 0-10 GHz bandı için
incelenmiştir. Ölçümler tam yansımasız odada gerçekleştirilirken, benzetimler CST
MW-Studio benzetim programıyla yapılmış ve elde edilen sonuçlar
karşılaştırılmıştır. Benzetim ve ölçüm sonuçlarının birbiri ile uyumlu olduğu
görülmüştür. Soğutucunun yansıma katsayısı, ışıma örüntüsü ve E-alan dağılımı
elde edilmiştir. Ayrıca tasarım parametrelere bağlı olarak E-alan değişimleri
verilmiştir. Önerilen soğutucunun rezonans frekansı 3,75 GHz olarak elde
edilmiş olup ve soğutucunun taban geometrisine bağlıdır. Ayrıca, E-alan dağılım
genliğinin frekans artışı ile azaldığı tespit edilmiştir.
Keywords
Thanks
Ölçümlerimizi gerçekleştirdiğimiz Akdeniz Üniversitesi Endüstriyel ve Medikal Uygulamalar Mikrodalga Araştırma Uygulama Merkezi (EMUMAM) Müdürlüğüne (Proje No: DPT-2007K120530) teşekkürlerimizi sunarız.
References
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- Covert, L., Lin, J., Janning, D. and Dalrymple, T. (2008). “5.8 GHz orientation‐specific extruded‐fin heatsink antennas for 3D RF system integration”, Microwave and Optical Technology Letters, 50(7), 1826-1831.
- Payandeh, M., Belov, I., Jarfors, A. E. and Wessén, M. (2016). “Effect of Material Inhomogeneity on Thermal Performance of a Rheocast Aluminum Heatsink for Electronics Cooling”, Journal of Materials Engineering and Performance, 25(6), 2116-2127.
- Mousavi, H., Darzi, A. A. R., Farhadi, M. and Omidi, M. (2018). “A novel heat sink design with interrupted, staggered and capped fins”, International Journal of Thermal Sciences, 127, 312-320.
- Meng, X., Zhu, J., Wei, X. and Yan, Y. (2018). “Natural convection heat transfer of a straight-fin heat sink”, International Journal of Heat and Mass Transfer, 123, 561-568.
- Lampio, K. and Karvinen, R. (2018). “A new method to optimize natural convection heat sinks”, Heat and Mass Transfer, 54(8), 2571-2580.
- Park, H. H., Jung, J. H., Jang, T. S., Han, S. T., Song, S. H., Park, J. J., and Park, H. B. (2009). “Prediction of radiated EMI from PCB excited by switching noise of IC”, Microwave and Optical Technology Letters, 51(10), 2262-2266.
- Manivannan, S., Arumugam, R., Paramasivam, S., Salil, P. and Rao, B. S. (2010). “HFSS simulation, experimental investigation, and optimization of heat sink EMI”, IET Power Electronics, 3(6), 881-891.
- Genc, A. and Helhel, S. (2019). “The comparison of em characteristics of the heatsinks with equal base area depending on the various geometries”, 10th International Symposium on Intelligent Manufacturing and Service Systems, Sakarya Üniversitesi, Sakarya, 979-985.
- Diepenbrock, J. C., Archambeault, B. and Hobgood, L. D. (2001). “Improved grounding method for heat sinks of high-speed processors”, IEEE 51st Electronic Components and Technology Conference, 993-996.
- Chiappe, J. (2012). “Additional techniques to reduce heatsink emissions utilizing RF absorbers”, In 2012 IEEE International Symposium on Electromagnetic Compatibility, Orlando, 56-63.
- Dogan, H., Basyigit, I. B. and Genc, A. (2019). “Variation of radiated emission from heatsinks on PCB according to fin types”, IEEE 3rd International Symposium on Multidisciplinary Studies and Innovative Technologies, 11-13 October 2019, Ankara.
- Gong, X. and Ferreira, J. A. (2013). “Investigation of conducted EMI in SiC JFET inverters using separated heat sinks”, IEEE Transactions on Industrial Electronics, 61(1), 115-125.
- An, B. H., Kim, H. J., and Kim, D. K. (2012). “Nusselt number correlation for natural convection from vertical cylinders with vertically oriented plate fins”, Experimental Thermal and Fluid Science, 41, 59-66.
- Lee, J., Kim, H. and Kim, D. K. (2016). “Experimental study of natural convection cooling of vertical cylinders with inclined plate fins”, Energies, 9(391), 1-15.
Year 2020,
Volume: 13 Issue: 2, 502 - 510, 31.08.2020
Abstract
References
- Khattak, Z. and Ali, H. M. (2019). “Air-cooled heat sink geometries subjected to forced flow: A critical review”, International Journal of Heat and Mass Transfer, 130, 141-161.
- Covert, L., Lin, J., Janning, D. and Dalrymple, T. (2008). “5.8 GHz orientation‐specific extruded‐fin heatsink antennas for 3D RF system integration”, Microwave and Optical Technology Letters, 50(7), 1826-1831.
- Payandeh, M., Belov, I., Jarfors, A. E. and Wessén, M. (2016). “Effect of Material Inhomogeneity on Thermal Performance of a Rheocast Aluminum Heatsink for Electronics Cooling”, Journal of Materials Engineering and Performance, 25(6), 2116-2127.
- Mousavi, H., Darzi, A. A. R., Farhadi, M. and Omidi, M. (2018). “A novel heat sink design with interrupted, staggered and capped fins”, International Journal of Thermal Sciences, 127, 312-320.
- Meng, X., Zhu, J., Wei, X. and Yan, Y. (2018). “Natural convection heat transfer of a straight-fin heat sink”, International Journal of Heat and Mass Transfer, 123, 561-568.
- Lampio, K. and Karvinen, R. (2018). “A new method to optimize natural convection heat sinks”, Heat and Mass Transfer, 54(8), 2571-2580.
- Park, H. H., Jung, J. H., Jang, T. S., Han, S. T., Song, S. H., Park, J. J., and Park, H. B. (2009). “Prediction of radiated EMI from PCB excited by switching noise of IC”, Microwave and Optical Technology Letters, 51(10), 2262-2266.
- Manivannan, S., Arumugam, R., Paramasivam, S., Salil, P. and Rao, B. S. (2010). “HFSS simulation, experimental investigation, and optimization of heat sink EMI”, IET Power Electronics, 3(6), 881-891.
- Genc, A. and Helhel, S. (2019). “The comparison of em characteristics of the heatsinks with equal base area depending on the various geometries”, 10th International Symposium on Intelligent Manufacturing and Service Systems, Sakarya Üniversitesi, Sakarya, 979-985.
- Diepenbrock, J. C., Archambeault, B. and Hobgood, L. D. (2001). “Improved grounding method for heat sinks of high-speed processors”, IEEE 51st Electronic Components and Technology Conference, 993-996.
- Chiappe, J. (2012). “Additional techniques to reduce heatsink emissions utilizing RF absorbers”, In 2012 IEEE International Symposium on Electromagnetic Compatibility, Orlando, 56-63.
- Dogan, H., Basyigit, I. B. and Genc, A. (2019). “Variation of radiated emission from heatsinks on PCB according to fin types”, IEEE 3rd International Symposium on Multidisciplinary Studies and Innovative Technologies, 11-13 October 2019, Ankara.
- Gong, X. and Ferreira, J. A. (2013). “Investigation of conducted EMI in SiC JFET inverters using separated heat sinks”, IEEE Transactions on Industrial Electronics, 61(1), 115-125.
- An, B. H., Kim, H. J., and Kim, D. K. (2012). “Nusselt number correlation for natural convection from vertical cylinders with vertically oriented plate fins”, Experimental Thermal and Fluid Science, 41, 59-66.
- Lee, J., Kim, H. and Kim, D. K. (2016). “Experimental study of natural convection cooling of vertical cylinders with inclined plate fins”, Energies, 9(391), 1-15.
There are 15 citations in total.
Details
| Primary Language | Turkish |
|---|---|
| Subjects | Engineering |
| Journal Section | Makaleler |
| Authors | |
| Publication Date | August 31, 2020 |
| Published in Issue | Year 2020 Volume: 13 Issue: 2 |